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Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the inherently low adhesive strength and structural integrity of polymer thermal interface materials (TIMs), they present a likely point of failure when succumbed to thermomechanical stresses in electronics packaging. ...
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As power densities and switching frequencies dramatically increase in wide bandgap power electronics, electromagnetic interference (EMI) increasingly impacts power conversion efficiency, and reliability, which requires ...
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ...